SD-GF35

SD-GF35 is a two-component thermal interface material, cured at room or elevated temperature, featuring ultra-high thermal performance and superior softness. SD-GF35 with 3.5W/m·K thermal conductivity is a good solution for interfacing fragile components with high topography and/or stack-up tolerances to normal heat sink or housing. After cured, SD-GF35 remains a low modulus elastomer to help relieving stress during application and prevent pump-out from the interface. SD-GF35 is with lightly stickiness but not designed to be a structural adhesive.

Features and Benefits

• Thermal conductivity: 3.5 W/m·K
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient and accelerated cure schedules
• Excellent low and high temperature mechanical and chemical stability

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color , Part A/B	White/Blue	Visual
Viscosity as Mixed	1,000,000 mPas	ASTM D2196
Density	3.1g/cc	ASTM D792
Mix Ratio	1:1	-
Shelf Life @ 25°C	6 months	ASTM D412
PROPERTY AS CURED
Color	Blue	Visual
Hardness, Shore 00	35	ASTM D2240
ELECTRICAL AS CURED
Dielectric Strength	7kV/mm	ASTM D149
Volume Resistivity (Ω·cm)	> 10¹⁰	ASTM D257
Flame Rating	V-0	UL 94
THERMAL AS CURED
Thermal Conductivity (W/m·K)	3.5	ASTM D5470
CURE SCHEDULE
Pot life @ 25 °C	60 mins.
Cure @ 25 °C	24 hrs.
Cure @ 120 °C	30 mins.

Typical Applications

• Automotive electronics
• Computer and peripherals
• Between any heat-generating semiconductor and a heat sink
• Telecommunications
• Thermally conductive vibration dampening

Available Forms

• Supplied in cartridge or barrel