SD-TA15GB

SD-TA15GB is a one-part silicon-based adhesive with high thermal conductive performance, filled with glass bead in order to get a minimum ‘gap’ between two surfaces. The thermal conductivity of SD-TA15GB is 1.5W/m-K. It can adhere well on the rough surfaces of electronic component with a better strength and proper toughness.

Notices： SD-TA15GB can not contact with N, P, S and other organic compounds, no contact with Sn, Pb, Hg, Bi. As plasma compounds, non contact with acetylene, vinyl active compounds, inability to contact

Features and Benefits

• Thermal conductivity: 1.5 W/m·K

• Glass beads filled

• High thermal conductivity

• Single components

• Good adhesion to substrates

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color	Grey	Visual
Viscosity	60,000 cps	ASTM D2196
Density	2.7 g/cc	Helium Pycnometer
BLT	0.18mm	-
Shelf Life @ 0±5℃	6 months	-
Hardness	Shore A 90	ASTM D2240
Unprimed Adhesion-Lap Shear (Al)	4 MPa	ASTM D412
Elongation	10%	ASTM D412
Temperature Usage	-40℃ to 200℃	-
Dielectric Strength	200 VAC/mil	ASTM D149
Volume Resistivity	1013Ω·cm	ASTM D257
Thermal Conductivity	1.5W/m·K	ASTM D5470
Cure @ 125 ℃	40 mins	-

Typical Applications

• Bonding integrated circuit substrates

• Adhering lids and housings

• Base plate attach

• Heat sink attach, automated or manual dispensing

• Thermally conductive structural bonding

Available Forms

• Supplied in 30cc/150cc Syringe